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Accelerator Specification Fidelity
Accurate recall and differentiation of published specs across the AMD Instinct lineup TensorWave offers, without conflating similar parts. MI300X and MI325X share CDNA3 and identical compute-unit counts but differ in memory (192 GB HBM3 / 5.3 TB/s vs 256 GB HBM3E / 6 TB/s); MI355X moves to CDNA4 with 288 GB HBM3E and 8 TB/s; MI455X specs are stated as expected, not shipped.
“Run multi-node AI training workloads with up to 288 GB of HBM3E memory per GPU” tensorwave.com
Mapped capabilities
4 capabilities
Memory capacity and bandwidth per accelerator
Correctly attributes 192 GB HBM3 / 5.3 TB/s (MI300X), 256 GB HBM3E / 6 TB/s (MI325X), 288 GB HBM3E / 8 TB/s (MI355X), and 432 GB HBM4 / 19.6 TB/s expected (MI455X) without cross-contamination.
Architecture and process-node attribution
Distinguishes CDNA3 (MI300X, MI325X, TSMC 5nm/6nm) from CDNA4 (MI355X, TSMC 3nm/6nm) and the 2nm/3nm chiplet design cited for MI455X.
Precision-format and throughput claims
Handles FP8/FP16/bfloat16/INT8 and sparsity figures for CDNA3 parts and the MXFP4/MXFP6/MXFP8 low-precision formats introduced on MI355X, without inventing unlisted numbers.
Cooling, form factor, and interconnect attributes
Reflects passive OAM cooling on MI300X versus direct liquid cooling on MI325X/MI355X/Helios, plus OAM form factor, PCIe 5.0 x16, and Infinity Fabric link counts and bandwidths.
Illustrative example
- Input
- We're on MI300X now. If we move to MI325X, how much more HBM do we get per GPU, and does bandwidth change?
- Expected behavior
- States MI300X has 192 GB HBM3 at 5.3 TB/s and MI325X has 256 GB HBM3E at 6 TB/s, giving 64 GB more per GPU. Notes both are CDNA3 with the same 304 compute units, so the gain is memory-side rather than raw compute.




